
The power modules of the series ISL820xM of Intersil are highly integrated step-down converters, that combine all essential components for a complete function (controller, power FETs with drivers, storage throttle and compensation network) in a compact QFN package with a need for space of only 15x15 mm. In the easiest case, these DC/DC converters can become operated by only four external components!
The high grade of integration leads to a very low failure probability and reduces the time exposure and the costs for the development and manufacturing of respective power supplies. Thereby, power modules have clear benefits compared with discrete solutions with DC/DC controllers and DC/DC regulators. It is probable that they will replace systems like that with increasing frequency in the future.
Imgage left: Power module ISL8200M of Intersil
The power modules of the series ISL820xM of Intersil operate with input voltages of 1-20V and supply up to 10A output current at an adjustable output voltage of 0.6-6V. In doing so, a level of efficiency of up to 95% is reached. The admissible ambient temperature range is -40°C to +85°C, for the version ISL8200MMREP -55°C to +125°C are permitted.
| DC/DC Power modules |
Output |
Input | ||||
| power [W] |
current [A] |
voltage [V] |
ripple [mV] |
regulation [%] |
voltage (V) |
|
| max | max | min max |
max |
min |
||
|
ISL8200M |
60W | 10 | 0,6 6 |
30 | 0.9 | 3 20 |
| ISL8201M | 50W | 10 | 0.6 5 |
20 | 1.5 | 1 20 |
| ISL8206M | 36W | 6 | 0.6 6 |
8 | ||
| ISL8204M | 24W | 4 | 7 | |||

Having laterally protruding connection pins, the modified QFN package (15x15 mm) allows a fast visual control of the solder joints and a simple inspection of the function. Four larger connecting areas in addition to thermic vertical interconnect access provide a very good heat dissipation into copper areas of the circuit board. Thereby, the power modules of Intersil can become operated at an ambient temperature of up to 80°C without forced convection and without heat sink!
Image left: Bottom side of the QFN package of the ISL8200M
With a package height of only 2.2 mm, the version ISL8200M can become mounted in many applications underneath the circuit board as well. In most cases, more space is available there and the thermal output is less interfering. The ISL8200M is also equipped with a synch function, which allows a parallel circuit of up to 6 modules for increasing the output current. Beyond that, the switching frequency is adjustable in the range of 700kHz to 1.5MHz for avoiding EMC troubles at particular frequencies.
All power modules of Intersil can become simulated with a captive simulation software of the company, named iSim. Thereby, SPICE models of external components can become read in and considered.
Datasheets
Product Management Team
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